Sales Engineer

Experience Required:
None
Educational Requirements:
Bachelor's degree or higher
Work Location:
Xi'an

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Responsibilities:

1.Responsible for the sales and marketing of the company's Cadmium Zinc Telluride (CZT) semiconductor nuclear radiation detectors, related radiation detection modules, and complete product solutions.

2.Organize, draft, and implement sales plans and targets.

3.Keep abreast of market dynamics, actively explore new fields, and provide strong information support for company senior decision-making.

Qualifications:

1.Bachelor's degree or above in marketing management or electronics-related fields.

2.Priority consideration will be given to candidates with backgrounds in nuclear physics, nuclear instrumentation, nuclear detection, medical radiation imaging, or those with strong English skills.

3.Familiarity with project bidding operations and over two years of sales experience in related industries.

4.Possess strong market development and communication skills, keen observation, adaptability, planning, and teamwork abilities.

5.Able to withstand high work pressure, strong sense of responsibility, and adapt to regular business trips.

Radiation Detection Engineer

Experience Required:
More than three years
Educational Requirements:
Bachelor's degree or above
Work Location:
Xi'an

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Responsibilities:

1.Responsible for the hardware design and debugging of nuclear detection project products.

2.Responsible for nuclear detection project requirements analysis, selecting appropriate electronic components, and PCB layout.

3.Conduct product reliability tests and analyze the reasons for product reliability test failures.

4.Assist the project team in completing the set tasks, report work progress in a timely manner, write related design documents, and assist in the formulation of mass production documents with the process team.

Qualifications:

1.Bachelor's degree or above in radiation protection, nuclear electronics, nuclear physics, electronics, or related fields.

2.More than three years of work experience related to nuclear instruments and meters.

3.Understanding of the working principles of various semiconductor detectors, readout circuits, and detection applications.

4.Priority will be given to candidates with relevant industry background and majors directly related to the job.

5.Strong project implementation communication and coordination skill.

FPGA Engineer

Experience Required:
3+ years
Educational Requirements:
Bachelor's degree or above
Work Location:
Xi'an

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Responsibilities:

1.FPGA hardware circuit design, device selection, logic timing development, pre-simulation, post-simulation, timing constraints, etc. (including sub-module architecture design, coding, debugging).

2.Proficient in Verilog/VHDL coding, with independent FPGA coding, simulation, and debugging capabilities.

3.Capable of independently undertaking projects with good documentation habits.

4.Solid hardware foundation, familiar with the collaborative work process of FPGA, DSP, and ARM.

Qualifications:

1.Bachelor's degree or above in communication, signal and information processing, electronic engineering, automatic control, microelectronics, image processing, or related fields, with more than 3 years of work experience.

2.Familiar with Verilog/VHDL programming languages, proficient in FPGA development tools such as Quartus/Vivado.

3.More than 3 years of FPGA development experience, familiar with FPGA design and verification process.

4.Priority will be given to those with experience in high-speed data acquisition, high-speed transmission, and image processing.

5.Preference for candidates with experience in rapid ADC, Gigabit Ethernet, PCIe cards, and high-frequency PCB layout.

Packaging Design Engineer

Experience Required:
At least 2 years
Educational Requirements:
Bachelor's degree or above
Work Location:
Xi'an

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Responsibilities:

1.Responsible for the design of device packaging structures, including thermal and mechanical numerical simulations.

2.Proficient in various numerical simulation software.

3.In charge of designing, developing, and validating new product packaging processes. Must have experience in electronic packaging and be skilled in one to two finite element numerical simulation software, such as Fortran, Fluent, etc.

Qualifications:

1.Bachelor's degree or above in Physics, Materials, Electronics, or related fields, with strong hands-on ability.

2.At least two years of experience in semiconductor packaging.

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